Epoxy Resin Curing Agent (Dycure Series)

【PRODUCT NAME】：Epoxy resin curing agent (Dycure Series)

【MOLECULAR FORMULA】：C2H4N4

【MOLECULAR WEIGHT】：84.08 

【CAS No.】：461-58-5

【PACKING】：15kg/cartons

【PRODUCT DESCRIPTION:】：Dycure 10 is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clomping and improve application.It is designed for use as a latent curing agent for epoxy resins.

【PRODUCT USAGE】 Dycure used at thermosetting epoxy resin system as latent curing agent, which is less than 1.6%of dispersant, in order to prevent the product caking and promote Dycure evenly dispersed in the epoxy resin system, widely used in one-component adhesive glue agent,composite materials and powder coating. Also supply customized supply customized 10um, 8um, 6um, 4pm, etc.

【ADVANTAGE】： 

1. Fine particle size provides enhanced reactivity versus coarser grades.

2. Easily dispersed in liquid resins.

3. Shelf stability up to 6 months at 25°C in properly formulated systems.

4. Activation temperature can be easily varied from 180° C to 100° C with appropriate accelerator selection.

【APPLICATION】：

1. One component adhesives

2. Epoxy powder coatings

3. Prepregs and film adhesives

4. Electronic potting and encapsulating compounds

【SPECIFICATION】